Method of manufacturing ink-jet printer head
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 5, 2002
Grant Date -
N/A
app pub date -
Jan 27, 2000
filing date -
Feb 1, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printer head substrate having a silicon substrate on which heat generating elements and partitions are formed and an orifice plate which adhered to the partitions is placed on a stage of a helicon-wave dry etching system. Helicon-wave dry etching is performed while cooling the printer head substrate by allowing a coolant gas to be intervened between the substrate and the stage. This allows multiple orifices of a desired and adequate shape to be simultaneously and quickly bored in the orifice plate even if a thin film sheet having adhesive layers adhered to both sides thereof is used as the orifice plate, thereby improving the working efficiency.
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