Adaptor assembly for interchangeably mounting hot air solder reflow nozzles to soldering/desoldering apparatus
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United States of America Patent
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-
Nov 5, 2002
Grant Date -
N/A
app pub date -
Feb 19, 1997
filing date -
Feb 19, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Handheld and stationary hot air solder reflow apparatus for repairing, reworking or producing electronic components and circuit boards of the type having a means for supplying a flow of hot air to an outlet tube are provided with a nozzle adaptor which has an internal adapter body which is resiliently carries a support collar which is held in an axial direction relative to the internal body by a spring. A bezel ring having a plurality of receiving tabs is mounted in the support collar, the tabs on the bezel ring in the support collar engage tabs on a mounting plate of each nozzle assembly, causing compression of the spring and resulting in a clamping of the mounting plate between a bottom surface of the internal body and the bezel ring.
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