Hot plate cooling method and heat processing apparatus
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United States of America Patent
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Nov 5, 2002
Issued Date -
N/A
app pub date -
Apr 12, 2001
filing date -
Aug 11, 1999
priority date (Note) -
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Abstract
In a heat processing apparatus structured to heat a wafer on a hot plate, a black plate at least the rear face of which practically has a color with a JIS lightness of 0V to 4V is positioned above the hot plate. Moreover, cooling air is blown out from nozzles onto the rear face of the hot plate. Thus, the temperature of the hot plate can be cooled rapidly.
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