Lead frame and method of manufacturing the lead frame
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United States of America Patent
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Nov 5, 2002
Grant Date -
Feb 21, 2002
app pub date -
Dec 8, 2000
filing date -
Aug 17, 2000
priority date (Note) -
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Abstract
A method for manufacturing a lead frame including the steps of electrocleaning the surface of a thin plate material, electropolishing the electrocleaned thin plate material, removing inclusions on the surface of the electropolished thin plate material, rinsing the inclusion-removed thin plate material with an acidic solution, and forming multi-plated layers on the rinsed material. The lead frame manufactured by the method has 5 or less inclusions each having approximately 1 .mu.m, on the surface area of 1600 .mu.m.sup.2, which impede a wire bonding property or solder wettability of the lead frame.
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