Flip chip and packaged memory module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 5, 2002
Grant Date -
N/A
app pub date -
Jul 19, 2000
filing date -
Jul 19, 2000
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A multi-chip, module (MCM) having one or more high value chips such as ASICs, CPUs, DSPs or the like attached to the MCM substrate via a direct attach technology (such as flip chip) and one or more memory chips attached to the MCM substrate via a reworkable technology such as connector and receptacle-based package, wirebond package, chip scale package (CSP), leaded package, ball grid array package, or fine pitch ball grid array package. The MCM substrate may, in turn, be attached to a motherboard via solder balls (ball grid array); leads and/or connector interconnect technologies (such as compression sockets).
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