US Patent No: 6,475,833
Number of patents in Portfolio can not be more than 2000
Bumpless flip chip assembly with strips and via-fill
Stats
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Nov 5, 2002
Issued date -
May 10, 2001
filing date -
09/852,674
serial no -
In Force
status
Importance
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Abstract
A flip chip assembly, and methods of making the same, including a substrate circuitry having a plurality of via apertures or holes, wherein preformed strips or wires hanging therein and filled conductive material together serve as the electrical connection between a semiconductor device and substrate circuitry. The method and device in accordance with the present invention may include attaching an integrated circuit (IC) chip to a rigid or flexible substrate circuitry having a plurality of pre-formed strips extending from patterned circuitry traces and hanging inside a plurality of through holes. These through holes are aligned and placed above the terminal pads so that the respective traces on the substrate can be readily connected to the respective input/output terminal pads of the IC chip through the leads inside the via apertures or holes. After attachment, an electrically conductive material, for example without limitation, adhesive or solder, is subsequently filled into the blind vias thereby connecting the leads-in-via to the terminal pads-in-via. The joining material not only provides the mechanical support but also the electrical continuity between IC chip and the circuitry of the substrate.
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First Claim
Related Publications
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International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 5,137,845 Method of forming metal contact pads and terminals on semiconductor chips | 162 | 1991 | |
| 5,209,817 Selective plating method for forming integral via and wiring layers | 181 | 1991 | |
| 5,483,421 IC chip attachment | 166 | 1992 | |
| 5,275,330 Solder ball connect pad-on-via assembly process | 145 | 1993 | |
| 5,542,601 Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate | 104 | 1995 | |
| 5,691,041 Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer | 244 | 1995 | |
| 5,822,856 Manufacturing circuit board assemblies having filled vias | 160 | 1996 | |
| 5,883,435 Personalization structure for semiconductor devices | 171 | 1996 | |
| 5,774,340 Planar redistribution structure and printed wiring device | 156 | 1996 | |
| 5,798,285 Method of making electronic module with multiple solder dams in soldermask window | 107 | 1997 | |
| 6,127,204 Column grid array or ball grid array pad on via | 79 | 1998 | |
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| 4,970,571 Bump and method of manufacturing the same | 132 | 1988 | |
| 5,654,584 Semiconductor device having tape automated bonding leads | 78 | 1994 | |
| 5,556,814 Method of forming wirings for integrated circuits by electroplating | 81 | 1995 | |
| 5,556,810 Method for manufacturing a semiconductor device wherein a semiconductor chip is connected to a lead frame by metal plating | 87 | 1995 | |
| 5,536,973 Semiconductor device including a semiconductor element mounted on a substrate using bump-shaped connecting electrodes | 95 | 1995 | |
| 5,648,686 Connecting electrode portion in semiconductor device | 97 | 1995 | |
| 5,665,652 Method for manufacturing a semiconductor device wherein electrodes on a semiconductor chip are electrically connected to lead terminals by plating bonding | 92 | 1996 | |
| 5,801,447 Flip chip mounting type semiconductor device | 92 | 1996 | |
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| 5,438,477 Die-attach technique for flip-chip style mounting of semiconductor dies | 158 | 1993 | |
| 5,489,804 Flexible preformed planar structures for interposing between a chip and a substrate | 179 | 1993 | |
| 5,572,069 Conductive epoxy grid array semiconductor packages | 79 | 1995 | |
| 5,637,920 High contact density ball grid array package for flip-chips | 246 | 1995 | |
| 5,723,369 Method of flip chip assembly | 117 | 1996 | |
| 5,801,072 Method of packaging integrated circuits | 139 | 1996 | |
| 5,731,223 Array of solder pads on an integrated circuit | 88 | 1996 | |
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| 5,284,796 Process for flip chip connecting a semiconductor chip | 158 | 1992 | |
| 5,334,804 Wire interconnect structures for connecting an integrated circuit to a substrate | 148 | 1992 | |
| 5,454,161 Through hole interconnect substrate fabrication process | 112 | 1993 | |
| 5,475,236 Semiconductor chip for mounting on a semiconductor package substrate by a flip-clip process | 144 | 1995 | |
| 5,722,162 Fabrication procedure for a stable post | 89 | 1995 | |
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| 5,789,271 Method for fabricating microbump interconnect for bare semiconductor dice | 158 | 1996 | |
| 5,808,360 Microbump interconnect for bore semiconductor dice | 133 | 1996 | |
| 5,736,456 Method of forming conductive bumps on die for flip chip applications | 211 | 1996 | |
| 6,084,781 Assembly aid for mounting packaged integrated circuit devices to printed circuit boards | 125 | 1998 | |
| 6,084,297 Cavity ball grid array apparatus | 195 | 1998 | |
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| 5,757,071 C4 substrate contact pad which has a layer of Ni-B plating | 81 | 1996 | |
| 5,804,771 Organic substrate (PCB) slip plane "stress deflector" for flip chip deivces | 101 | 1996 | |
| 6,020,561 Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof | 109 | 1996 | |
| 6,046,909 Computer card with a printed circuit board with vias providing strength to the printed circuit board | 98 | 1998 | |
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| 5,663,598 Electrical circuit bonding interconnect component and flip chip interconnect bond | 84 | 1995 | |
| 5,674,785 Method of producing a single piece package for semiconductor die | 342 | 1995 | |
| 5,739,585 Single piece package for semiconductor die | 403 | 1996 | |
| 5,811,879 Stacked leads-over-chip multi-chip module | 195 | 1997 | |
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| 5,682,061 Component for connecting a semiconductor chip to a substrate | 160 | 1995 | |
| 5,861,666 Stacked chip assembly | 233 | 1996 | |
| 5,994,222 Method of making chip mountings and assemblies | 105 | 1997 | |
| 6,012,224 Method of forming compliant microelectronic mounting device | 119 | 1997 | |
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| 5,074,947 Flip chip technology using electrically conductive polymers and dielectrics | 209 | 1989 | |
| 5,196,371 Flip chip bonding method using electrically conductive polymer bumps | 189 | 1991 | |
| 5,237,130 Flip chip technology using electrically conductive polymers and dielectrics | 162 | 1991 | |
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| 5,293,067 Integrated circuit chip carrier | 120 | 1992 | |
| 5,439,162 Direct chip attachment structure and method | 124 | 1993 | |
| 5,424,245 Method of forming vias through two-sided substrate | 160 | 1994 | |
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| 5,346,750 Porous substrate and conductive ink filled vias for printed circuits | 173 | 1993 | |
| 5,484,647 Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same | 148 | 1994 | |
| 5,645,628 Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device | 93 | 1995 | |
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| 5,358,621 Method of manufacturing semiconductor devices | 88 | 1992 | |
| 5,633,204 Method and apparatus for forming bump structure used for flip-chip mounting, the bump structure and the flip-chip | 127 | 1995 | |
| 6,037,665 Mounting assembly of integrated circuit device and method for production thereof | 153 | 1998 | |
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| 5,547,740 Solderable contacts for flip chip integrated circuit devices | 135 | 1995 | |
| 5,803,340 Composite solder paste for flip chip bumping | 99 | 1995 | |
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| 5,493,096 Thin substrate micro-via interconnect | 114 | 1994 | |
| 5,599,744 Method of forming a microcircuit via interconnect | 108 | 1995 | |
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| 5,595,943 Method for formation of conductor using electroless plating | 98 | 1995 | |
| 5,870,289 Chip connection structure having diret through-hole connections through adhesive film and wiring substrate | 224 | 1995 | |
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| 5,487,218 Method for making printed circuit boards with selectivity filled plated through holes | 182 | 1994 | |
| 5,611,140 Method of forming electrically conductive polymer interconnects on electrical substrates | 145 | 1995 | |
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| 6,316,830 Bumpless flip chip assembly with strips and via-fill | 14 | 1999 | |
| 6,319,751 Bumpless flip chip assembly with solder via | 12 | 1999 | |
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| 5,619,791 Method for fabricating highly conductive vias | 90 | 1995 | |
| 6,013,877 Solder bonding printed circuit boards | 104 | 1998 | |
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| 5,167,992 Selective electroless plating process for metal conductors | 90 | 1991 | |
| 5,116,463 Detecting completion of electroless via fill | 100 | 1991 | |
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| 5,261,593 Direct application of unpackaged integrated circuit to flexible printed circuit | 149 | 1992 | |
| 5,615,477 Method for interconnecting a flip chip to a printed circuit substrate | 156 | 1996 | |
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| 5,508,229 Method for forming solder bumps in semiconductor devices | 140 | 1994 | |
| 5,627,405 Integrated circuit assembly incorporating an anisotropic elecctrically conductive layer | 112 | 1995 | |
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| 4,984,358 Method of assembling stacks of integrated circuit dies | 162 | 1990 | |
| 5,407,864 Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip | 120 | 1993 | |
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| 5,613,296 Method for concurrent formation of contact and via holes | 90 | 1995 | |
| 5,744,859 Semiconductor device | 125 | 1996 | |
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| 5,397,921 Tab grid array | 306 | 1993 | |
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| 5,478,007 Method for interconnection of integrated circuit chip and substrate | 129 | 1994 | |
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| 5,477,933 Electronic device interconnection techniques | 243 | 1994 | |
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| 5,764,486 Cost effective structure and method for interconnecting a flip chip with a substrate | 103 | 1996 | |
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| 5,925,931 Semiconductor device having interconnect lines and connection electrodes formed in groove portions of an insulating layer | 162 | 1997 | |
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| 5,454,928 Process for forming solid conductive vias in substrates | 91 | 1994 | |
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| 5,611,884 Flip chip silicone pressure sensitive conductive adhesive | 124 | 1995 | |
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| 5,564,181 Method of fabricating a laminated substrate assembly chips-first multichip module | 95 | 1995 | |
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| 5,614,114 Laser system and method for plating vias | 138 | 1994 | |
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| 5,525,065 Cavity and bump interconnection structure for electronic packages | 90 | 1995 | |
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| 5,646,067 Method of bonding wafers having vias including conductive material | 227 | 1995 | |
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| 5,863,816 Fabrication method for chip size semiconductor package | 79 | 1997 | |
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| 5,106,461 High-density, multi-level interconnects, flex circuits, and tape for tab | 266 | 1990 | |
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| 6,103,552 Wafer scale packaging scheme | 173 | 1998 | |
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| 5,327,010 IC card having adhesion-preventing sheets | 83 | 1990 | |
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| 5,576,052 Method of metallizing high aspect ratio apertures | 110 | 1996 | |
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| 5,583,073 Method for producing electroless barrier layer and solder bump on chip | 104 | 1995 | |
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| 5,627,406 Inverted chip bonded module with high packaging efficiency | 118 | 1996 | |
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| 5,656,858 Semiconductor device with bump structure | 164 | 1995 | |
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| 5,641,113 Method for fabricating an electronic device having solder joints | 145 | 1995 | |
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| 5,817,541 Methods of fabricating an HDMI decal chip scale package | 121 | 1997 | |
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| 5,666,008 Flip chip semiconductor device | 97 | 1996 | |
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| 5,674,787 Selective electroless copper deposited interconnect plugs for ULSI applications | 366 | 1996 | |
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| 5,447,886 Method for mounting semiconductor chip on circuit board | 125 | 1994 | |
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| 5,834,844 Semiconductor device having an element with circuit pattern thereon | 294 | 1996 | |
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| 5,757,081 Surface mount and flip chip technology for total integrated circuit isolation | 120 | 1996 | |
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| 5,355,283 Ball grid array with via interconnection | 362 | 1993 | |
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| 6,103,992 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias | 112 | 1996 | |
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| 4,955,523 Interconnection of electronic components | 186 | 1988 | |
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| 5,669,545 Ultrasonic flip chip bonding process and apparatus | 100 | 1996 | |
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| 5,260,234 Method for bonding a lead to a die pad using an electroless plating solution | 103 | 1991 | |
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| 6,018,196 Semiconductor flip chip package | 115 | 1999 | |
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| 6,403,400 Bumpless flip chip assembly with strips-in-via and plating | 7 | 2001 | |
| 6,406,939 Flip chip assembly with via interconnection | 16 | 2001 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 5, 2014 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |