Importance

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Abstract

A flip chip assembly, and methods of making the same, including a substrate circuitry having a plurality of via apertures or holes, wherein preformed strips or wires hanging therein and filled conductive material together serve as the electrical connection between a semiconductor device and substrate circuitry. The method and device in accordance with the present invention may include attaching an integrated circuit (IC) chip to a rigid or flexible substrate circuitry having a plurality of pre-formed strips extending from patterned circuitry traces and hanging inside a plurality of through holes. These through holes are aligned and placed above the terminal pads so that the respective traces on the substrate can be readily connected to the respective input/output terminal pads of the IC chip through the leads inside the via apertures or holes. After attachment, an electrically conductive material, for example without limitation, adhesive or solder, is subsequently filled into the blind vias thereby connecting the leads-in-via to the terminal pads-in-via. The joining material not only provides the mechanical support but also the electrical continuity between IC chip and the circuitry of the substrate.

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First Claim