Importance

Loading Importance Indicators...

Abstract

Stackable integrated circuit packages with pin and barrel interconnects are disclosed, along with methods of making such packages. In an exemplary embodiment, a package includes a molded plastic body, metal coated barrels on an upper side of the body, and metal coated pins on a lower side of the body. The pins are arranged coaxial with respective barrels. An integrated circuit is mounted on the upper side of the body. Metal traces electrically couple the integrated circuit to the barrels. Vias through the body electrically connect the metal coated barrels to respective metal coated pins. Two or more packages may be stacked and electrically coupled together by inserting the pins of a top package into the barrels of a lower package. The pins of the lower package may be soldered to a conventional printed circuit board, or may be mounted on a mounting substrate including corresponding metal coated barrels.

Loading the Abstract Image...

First Claim