Chip-size integrated circuit package having slits formed in an insulator tape
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United States of America Patent
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-
Nov 5, 2002
Grant Date -
N/A
app pub date -
Jun 7, 2000
filing date -
Jun 8, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In a chip-size package, an insulator tape is formed with a conductive wire having a wider section which is greater in width than other sections of the wire and a conductive bump connected to the wider section of the wire. The insulator tape is further formed with a first plurality of slits arranged on one side of the wider section of the wire and a second plurality of slits arranged on the other side of the wider section. An integrated circuit chip is provided having a conductive pad connected to the copper bump.
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