Method and device for full thickness resectioning of an organ

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6478210
SERIAL NO

10055306

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A full-thickness resection system comprises a flexible endoscope and a stapling mechanism, wherein the endoscope is slidably received through at least a portion of the stapling mechanism. The stapling mechanism comprises an anvil and a stapling head mounted to the anvil so that the anvil and the stapling head are moveable with respect to one another between a tissue receiving position and a stapling position and wherein a gap formed between the stapling head and the anvil is larger in the tissue receiving position than it is in the stapling position. A position adjusting mechanism is provided for moving the anvil and the stapling head between the tissue receiving and stapling positions and a staple firing mechanism sequentially fires a plurality of staples from the stapling head across the gap against the anvil and through any tissue received in the gap and a knife cuts a portion of tissue received within the gap. A control unit which remains outside the body is coupled to the stapling mechanism for controlling operation of the position adjusting mechanism and the staple firing mechanism.

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Patent Owner(s)

  • BOSTON SCIENTIFIC SCIMED, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adams, Ronald D Holliston, MA 72 31916
Buess, Gerhard F Tubingen-Bebenhausen, DE 17 14389
Kortenbach, Jurgen A Miami Springs, FL 23 17073
Kratsch, Peter K Sunrise, FL 39 16110
Main, Lauren O Somerset, MI 18 24996
Nunez, George A Miami, FL 9 13833
Schurr, Marc O Tubingen, DE 41 17637
Solar, Matt Cooper City, FL 8 9453
Sullivan, III Roy H Millville, MA 9 11509

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