Semiconductor fuse covering
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 12, 2002
Grant Date -
N/A
app pub date -
Dec 27, 2001
filing date -
Dec 27, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and system for sealing or covering exposed fuses on a semiconductor device are disclosed. A semiconductor device prober incorporating a spray device for applying a sealing compound to individual fuses on a semiconductor device subsequent to testing the semiconductor device is disclosed. A method and system for sealing exposed fuses on a semiconductor device is disclosed which allows the sealing step to be performed either prior to or following singulation of the semiconductor device into individual dice.
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