Method and apparatus for determining process layer conformality
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 12, 2002
Grant Date -
N/A
app pub date -
May 25, 2001
filing date -
May 25, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for determining conformality of a process layer includes providing a wafer having a grating structure and a process layer formed over the grating structure; illuminating at least a portion of the process layer overlying the grating structure with a light source; measuring light reflected from the illuminated portion of the grating structure and the process layer to generate a reflection profile; and determining conformality of the process layer based on the reflection profile. A metrology tool adapted to receive a wafer having a grating structure and a process layer formed over the grating structure includes a light source, a detector, and a data processing unit. The light source is adapted to illuminate at least a portion of the process layer overlying the grating structure. The detector is adapted to measure light reflected from the illuminated portion of the grating structure and the process layer to generate a reflection profile. The data processing unit is adapted to determine conformality of the process layer based on the generated reflection profile.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully