Semiconductor device with two stacked chips in one resin body and method of producing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 12, 2002
Grant Date -
May 30, 2002
app pub date -
Jan 2, 2002
filing date -
Jun 1, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully