Importance

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Abstract

A package is disclosed in which deterioration of insulating encapsulation resin attributable to the generation of heat at source wires caused by an increase in a drain current is prevented. Specifically, there is provided a semiconductor package including a header made of metal, a semiconductor chip forming a power MOSFET secured on the header, an encapsulation element made of insulating resin covering the semiconductor chip, header and the like, a suspended lead contiguous with the header protruding from one side surface of the encapsulation element, a source lead and a gate lead protruding in parallel from one side surface of the encapsulation element, and wires positioned in the encapsulation element for connecting electrodes on the upper surface of the semiconductor chip and the source and gate leads. The source lead is constituted by a plurality of leads in parallel with each other, and the ends of the leads are coupled into one coupling portion in the encapsulation element. The coupling portion and the electrodes on the semiconductor chip are connected by a plurality of aluminum wires.

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First Claim