Method and apparatus of making a hole in a printed circuit board
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United States of America Patent
Stats
-
Nov 12, 2002
Grant Date -
N/A
app pub date -
May 25, 2000
filing date -
Nov 10, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention provides a method and an apparatus of making a hole in a printed circuit board, which improve the quality of a hole shape and the processing speed. In accordance with the invention, a control apparatus controls a laser oscillator and a galvano mirrors so as to form a hole while gradually reducing a pulse width in each step with respect to one hole. As a result of this, no insulating material is left on the bottom portion of the hole, and it is possible to make a hole having an intended shape, particularly, having a desired diameter of the hole bottom.
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