Process for forming a polyimide pattern with photosensitive composition for i-line stepper
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United States of America Patent
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Nov 19, 2002
Issued Date -
N/A
app pub date -
May 17, 2000
filing date -
Jul 22, 1992
priority date (Note) -
Expired
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Abstract
The present invention provides photosensitive compositions which comprise polyimide precursors having a chemical structure selected from several specific chemical structures and/or specific amide bond density and are adjusted so that the film obtained by applying and drying the composition may exhibit a specific absorbance to light. The polyimide film obtained by heat-curing the above photosensitive composition exhibits excellent physical properties and water resistance, and has high adhesive strength to epoxy resins, inorganic materials and metals.
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