Importance

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Abstract

The present invention provides a method of forming a gate structure of a floating gate MOS field effect transistor. The method comprises the steps of: forming a conductive layer on a gate insulating film; forming a dummy layer over the conductive layer; selectively forming a resist pattern over the dummy layer; carrying out an anisotropic etching process for patterning the dummy layer and the conductive layer by use of the resist pattern as a mask, thereby to form a gate structure removing the resist pattern; forming side wall insulation films on side walls of the gate structure; forming an inter-layer insulator so that the gate structure and the side wall insulation films are completely buried within the inter-layer insulator; carrying out a first planarization process for polishing the inter-layer insulator; and carrying out a second planarization process for selectively etching the inter-layer insulator and the side wall insulation films, so that at least a top portion of the dummy layer is etched; removing the dummy layer; carrying out a third planarization process for selectively etching the inter-layer insulator and the side wall insulation films, so that a planarized surface of the inter-layer insulator and the side wall insulation films is leveled to a planarized surface of the conductive layer, wherein the dummy layer has a higher etching selectivity to the inter-layer insulator than nitride.

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First Claim