Fluid pressure imprint lithography
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United States of America Patent
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Nov 19, 2002
Grant Date -
N/A
app pub date -
Jul 18, 2000
filing date -
Jul 18, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An improved method of imprint lithography involves using direct fluid pressure to press the mold into a substrate-supported film. Advantageously the mold and/or substrate are sufficiently flexible to provide wide area contact under the fluid pressure. Fluid pressing can be accomplished by sealing the mold against the film and disposing the resulting assembly in a pressurized chamber. It can also be accomplished by subjecting the mold to jets of pressurized fluid. The result of this fluid pressing is enhanced resolution and high uniformity over an enlarged area.
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