Multilayer flexible FR4 circuit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 19, 2002
Grant Date -
N/A
app pub date -
Nov 13, 2001
filing date -
Nov 13, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A flexible circuit (100) includes a first circuit path portion (110) and a second rigid circuit path portion (140) to which electronic components (102) may be coupled. Each circuit path portion (110 and 140) including a resin layer (112 and 142) and an adjacent conductive layer (114 and 144). Each circuit path portion (110 and 140) defining a gap (120 and 150) substantially running along a line corresponding to a desired bend location. A central circuit path portion (130) is disposed between the first circuit path portion (110) and the second rigid circuit path portion (140) and includes a first conductive layer (134) in electrical communication with the first circuit path portion (110) and a second conductive layer (136) in electrical communication with the second rigid circuit path portion (140), so as to provide electrical communication across the gaps (120 and 150). A metal plate (160) is disposed adjacent the second rigid circuit path portion (140).
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