Chip assembly with integrated power distribution between a wafer interposer and an integrated circuit chip
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United States of America Patent
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Nov 19, 2002
Grant Date -
N/A
app pub date -
May 19, 2000
filing date -
May 19, 2000
priority date (Note) -
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Abstract
A chip assembly (162) with integrated power distribution between an integrated circuit chip (164) and a section of wafer interposer (166) is disclosed. The wafer interposer section (166) has first (80, 82) and second (86, 88) sets of contact pads that are electrically and mechanically coupled to first and second sets of contact pads of the integrated circuit chip (164). The wafer interposer section (166) has first (32) and second (36) supply voltage terminals that are respectively coupled to the first (80, 82) and second (86, 88) sets of contact pads of the wafer interposer section (166) that provide first and second supply voltages to the first and second sets of contact pads of the integrated circuit chip (164), thereby integrating power distribution between the integrated circuit chip (164) and the wafer interposer section (166).
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