Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 19, 2002
Issued Date -
N/A
app pub date -
Aug 23, 2001
filing date -
Sep 5, 2000
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A semiconductor device includes a plurality of semiconductor chips; and a plurality of substrates, each of the substrates having one of the semiconductor chips mounted thereon. The substrates are stacked each other. The upper and lower ones of the semiconductor chips mounted on a pair of the stacked substrates are electrically connected through first terminals provided in a region outside the region in which one of the semiconductor chips is mounted in each of the substrates. The lowest one of the substrates has second terminals provided in its region closer to its center than its region in which the first terminals are provided, the second terminals electrically connected to one of the semiconductor chips. A pitch of adjacent two of the second terminals is wider than a pitch of adjacent two of the first terminals.
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