Virtual midplane to enhance card interconnections using a matrix of interconnecting assemblies
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United States of America Patent
Stats
-
Nov 26, 2002
Grant Date -
Nov 29, 2001
app pub date -
Dec 8, 1999
filing date -
Dec 8, 1999
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention is a method and apparatus for interconnection system. A first connector located on a first card provides first contacts for first signal traces on the first card. The first connector has a first housing enclosing the first contacts and a first extension portion. A second connector located on a second card provides second contacts for second signal traces on the second card. The second connector has a second housing enclosing the second contacts. The second connector is coupled to the first connector when the first and second housings are mated such that the first and second cards are substantially perpendicular to each other, the second card is aligned on the first extension portion.
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