Method for manufacturing laminated-ceramic electronic components
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United States of America Patent
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Nov 26, 2002
Grant Date -
N/A
app pub date -
Aug 4, 1994
filing date -
Mar 7, 1988
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a method of laminating ceramic greenware sheets with electrodes embedded therein (25) which is formed on a support by pressure-adhering a ceramic greenware sheet with an electrode embedded therein onto a second ceramic greenware sheet or other electrodes (23), then peeling off the support alone and transferring the ceramic greenware sheet with the embedded electrodes onto the second ceramic greenware sheet or the other electrodes. This manufacturing method enables it to laminate ceramic greenware sheets each the thickness of which is as thin as 20 micrometers or less, while maintaining their mechanical strength and embedded electrodes in the ceramic greenware sheets, thereby enabling it to prevent a occurrence of surface irregularities due to the thickness of the electrodes even when laminating to a high degree.
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