Semiconductor package with warpage resistant substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Nov 26, 2002
Grant Date -
N/A
app pub date -
Mar 19, 2001
filing date -
Mar 19, 2001
priority date (Note) -
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Abstract
A semiconductor package and a method for fabricating a semiconductor package are disclosed. The semiconductor package includes semiconductor chip attached to a circuit board that includes at least one lateral slot formed through the circuit board. Provision of the slot reduces stresses in the circuit board that are manifested by warpage. The semiconductor chip may be positioned in a central aperture of the circuit board and held therein by hardened encapsulant material.
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