Microelectronic assembly incorporating lead regions defined by gaps in a polymeric sheet
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United States of America Patent
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Nov 26, 2002
Grant Date -
Aug 2, 2001
app pub date -
Mar 2, 2001
filing date -
Sep 18, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A sheet such as a polymeric dielectric has elongated lead regions partially separated from the main region of the sheet by gaps in the sheet, and has conductors extending along the lead regions. The lead regions are connected to contacts on a microelectronic element, and the microelectronic element is moved away from the main region of the sheet, thereby bending the lead regions downwardly to form leads projecting from the main region of the sheet.
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