Method of forming chromium coated copper for printed circuit boards
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United States of America Patent
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Dec 3, 2002
Grant Date -
N/A
app pub date -
Feb 8, 2000
filing date -
Feb 8, 2000
priority date (Note) -
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Abstract
A method of applying a metal onto a copper layer, comprising the steps of: stabilizing a surface of a copper layer by applying a stabilization layer thereto, the stabilization layer comprised of zinc oxide, chromium oxide, nickel, nickel oxide or a combination thereof and having a thickness of between about 5 .ANG. and about 70 .ANG.; and vapor depositing a metal selected from the group consisting of aluminum, nickel, chromium, copper, iron, indium, zinc, tantalum, tin, vanadium, tungsten, zirconium, molybdenum and alloys thereof onto the stabilized surface of the copper layer, and a sheet material formed thereby.
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