Applying resistive layer onto copper
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United States of America Patent
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-
Dec 3, 2002
Issued Date -
N/A
app pub date -
Jul 31, 2000
filing date -
Feb 8, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 .ANG. and about 70 .ANG.. A vapor deposited resistive material is provided on the stabilization layer.
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