Electronic module with integrated thermoelectric cooling assembly
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United States of America Patent
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-
Dec 3, 2002
Grant Date -
May 30, 2002
app pub date -
Nov 30, 2000
filing date -
Nov 30, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electronic module is provided having an integrated thermoelectric cooling assembly disposed therein coupled to the module's electronic device. The thermoelectric assembly includes one or more thermoelectric stages and a thermal space transformer, for example, disposed between a first thermoelectric stage and a second thermoelectric stage. The electronic device is mounted to a substrate with the thermoelectric assembly disposed in thermal contact with the electronic device and a thermally conductive cap is positioned over the thermoelectric assembly, and is also in thermal contact with the thermoelectric assembly. Power to the thermoelectric assembly can be provided using electrically conductive springs disposed between one or more stages of the assembly and pads on an upper surface of the substrate, which electrically connect to power planes disposed within the substrate.
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