Printed-wiring board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6489574
SERIAL NO

09702763

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A printed wiring board having assembled thereon a grid array type package, a multi-terminal device with many terminals arranged in matrix, is provided, through first signal connection holes, signal lines, and second connection holes, with many numbers of lands divided into plural blocks, being arranged in matrix on a first layer to connect each terminal of the multi-terminal device correspondingly, signal line patterns connected with many lands, and drawn out in the same direction per block, and first signal patterns from lands positioned on the innermost line of many lands. Then, the wiring patterns of the signal lines are drawn out regularly from many lands formed in matrix on the assembling surface of the grid array type package to make it easier for the printed wiring board to effectuate wiring connections without making them complicated or increasing the number of layers of the printed wiring board. Also, with the provision of ground patterns that surround signal lines, it is made possible to reduce unwanted radiant, as well as to suppress the occurrence of malfunctions of electronic equipment due to reflections and ground bounces.

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Patent Owner(s)

Patent OwnerAddress
CANON KABUSHIKI KAISHATOKYO 146-8501

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inagawa, Hideho Yokohama, JP 23 388
Osaka, Toru Yokohama, JP 4 49
Otaki, Toru Tokyo, JP 7 88

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