Semiconductor device and method of manufacturing the same, manufacturing device, circuit board, and electronic equipment
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 3, 2002
Grant Date -
N/A
app pub date -
May 30, 2001
filing date -
Oct 1, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device includes at least one substrate (50) including a plurality of holes (56) and an interconnecting pattern (52) provided to one surface, part of the interconnecting pattern (52) being formed over the holes (56); at least one first semiconductor chip (10) including a plurality of electrodes (12) and provided to another surface of the substrate (50), at least one second semiconductor chip (20) including a plurality of electrodes (12) and provided to the one surface of the substrate (50); and a conductive member for electrically connecting the electrodes (12) of the first semiconductor chip (10) to the interconnecting pattern (52) and being disposed in the holes.
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