Temperature control of electronic devices using power following feedback
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United States of America Patent
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-
Dec 3, 2002
Grant Date -
May 2, 2002
app pub date -
Jul 14, 1999
filing date -
Oct 21, 1996
priority date (Note) -
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Abstract
A method for controlling a device temperature measures a parameter related to device power consumption and utilizes the parameter to control the device temperature. This can be achieved with a system including a heat exchanger, a power monitor, and a circuit which controls the temperature setting of the heat exchanger. The circuit uses as inputs the power level, heat exchanger temperature, and set point. The system thus eliminates the need for temperature sensing devices in or connected to a chip, responds to the temperature of the device and not the package, can be used for high volume chip manufacturing, does not require significant surface area of a device for temperature sensing, and eliminates the need for chip power profiles. Significantly, the system allows a set point to be maintained with minimal overshoot or undershoot.
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