Peripheral land grid array package with improved thermal performance
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United States of America Patent
Stats
-
Dec 3, 2002
Grant Date -
N/A
app pub date -
Jan 8, 2002
filing date -
Jan 8, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A flip-chip module is interconnected to a PCB or circuit card through a peripheral LGA interposer connector. The flip-chip is mounted on the same surface of the module substrate as the peripheral array of LGA interconnection pads and projects into a central opening of the interposer. An opening in the upper stiffener of the PCB or circuit card permits the peripheral array of LGA interconnection pads to make contact with corresponding LGA PCB or circuit card pads. A first heat sink is arranged to thermally contact the entire surface of the substrate opposing the surface upon which the flip-chip is mounted. An opening in the PCB or circuit card and lower stiffener allows a second heat sink to make thermal contact with the surface of the flip-chip.
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