Automatic electronic component-mounting apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 10, 2002
Grant Date -
N/A
app pub date -
Jan 24, 2000
filing date -
Jan 25, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An automatic electronic component-mounting apparatus is provided. A nut member is slidably arranged between a pair of rails. A head-lifting/lowering member is lowered and lifted with respect to the main block via the pair of rails and the nut member. A mounting head is attached to the head-lifting/lowering member. The head-lifting/lowering member is lowered and lifted to cause the mounting head to pick up an electronic chip component and then mount the electronic chip component on a printed circuit board. The head-lifting/lowering member is formed of a metal-ceramic composite material produced by combining a ceramic reinforcing material with a metal.
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