Head chip and head unit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 10, 2002
Grant Date -
Jan 10, 2002
app pub date -
May 24, 2001
filing date -
May 25, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A head chip and a head unit, in which manufacturing cost is reduced and also manufacturing steps are simplified, are provided. In a head chip 10 in which: partition walls 12 made of piezoelectric ceramic are arranged on two upper and lower sheets of a first board 11 and a second board 16 with predetermined intervals; chambers 13 are defined between the respective partition walls 12; a driver voltage is applied to electrodes 14 provided on the side surfaces of the partition walls 12 to change the capacity in ink flow paths; and the ink filled in the ink flow paths is jetted from nozzle openings, the first board 11 and the second board 16 are formed of a dielectric material; wiring lines 15 which are electrically conducted to the electrodes 14 and elongated to the outside of the end portions of the partition walls 12 in the longitudinal direction, are provided on the surface of any one of the first board 11 and the second board 16; and further the wiring lines 15 include an inorganic conductive film 15a as the lowermost layer and metal films 15b and 15c formed thereon.
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