Forming microelectronic connection components by electrophoretic deposition
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United States of America Patent
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Dec 10, 2002
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app pub date -
Jul 10, 1998
filing date -
Jul 10, 1998
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Abstract
An electrically conductive article such as a sheet having holes therein is coated with a dielectric polymer using a multi-stage electrophoretic deposition process. A coating of uncured polymer is deposited electrophoretically and then cured. After the first polymer is cured, the part is subject to a further electrophoretic deposition process and further curing. Use of a second electrophoretic deposition step allows effective coating of parts having small holes without plugging the holes. The coated parts may be used as microelectronic connection components such as chip carriers used in packaging semiconductor chips.
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