Microelectronic joining processes with bonding material application
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United States of America Patent
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Dec 10, 2002
Grant Date -
N/A
app pub date -
Mar 10, 2000
filing date -
Mar 10, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectronic element is provided with small meniscus-shaped solder masses, and these masses are connected to deformable connecting elements such as flexible leads. The connections can be made under vacuum in a chamber or in a space enclosed in part by a flexible film. Atmospheric pressure on the flexible film can urge the components together during bonding. Temporary securements such as adhesive bonds between the microelectronic element and the component can hold the microelectronic element in place relative to the component while electrical connections are made by conductive bonding material such a solder.
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