Importance

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Abstract

A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a base, wherein the chip includes a conductive pad, the base includes a recess, the conductive trace includes a bumped terminal in the recess, the bumped terminal includes a cavity that extends into and faces away from the recess, the base contacts and covers the conductive trace on a side opposite the chip, and the conductive trace and the base are different metals, mechanically attaching the chip to the conductive trace using an insulative adhesive that extends into the cavity, etching the base to expose the conductive trace, and forming a connection joint that contacts and electrically connects the conductive trace and the pad. Preferably, the bumped terminal is inside a periphery of the chip, and the adhesive fills the cavity.

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First Claim