Smart card module and method of assembling the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 10, 2002
Grant Date -
N/A
app pub date -
May 4, 2000
filing date -
Aug 3, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A module (10) for use with a smart card (50) is disclosed. The module (10) includes a substrate (14) having a first side (16) and a second side (18). The first and second sides each have deposited thereon a metallic layer (19, 21), with the substrate (14) having a thickness of about 125 microns. A die (22) is mounted adjacent the substrate first side (16), with the die (22) being coupled to the substrate first side (16) by a plurality of wire leads (24). A protective coating (26) covers the die (22), with the module having a total thickness of about 525 microns.
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