Interposer for connecting two substrates and resulting assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 10, 2002
Grant Date -
Nov 29, 2001
app pub date -
May 17, 2001
filing date -
May 24, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention is an interposer for electrically coupling a microcard with a mother board. The interposer includes a frame which is interposed between the microcard and the motherboard, electrically connecting the microcard and the motherboard by means of plated via-holes. The substrate is organic and a plurality of chips are mounted on both sides of the substrate. On the opposite sides of the interposer are pluralities of metal pads which are coupled by metallized via holes, the pads in turn connected to the chips, thereby coupling chips or cards on one side of the interposer to chips or boards on the other side. Electrical connection between the chips on the top side of the substrate and the metal pads on the lower side of the substrate is provided by the metallized via holes.
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