Importance

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Abstract

A method of using a socket to electrically interconnect a microelectronic assembly having electrically conductive joining units and a substrate having electrically conductive contacts includes providing a socket having a plurality of apertures with deflectable, resilient lip regions, and positioning the socket over the substrate so that the plurality of apertures are in substantial alignment with at least some of the electrically conductive contacts of the substrate. The microelectronic assembly is then juxtaposed with the substrate so that the socket is between the microelectronic assembly and the substrate and so that the joining units of the microelectronic assembly confront the contacts of the substrate. The joining units of the microelectronic assembly are then inserted into the apertures of the socket so that the conductive joining units deflect the deflectable lip regions of the socket for allowing the plurality of joining units to pass through each aperture, whereby the conductive joining units of the microelectronic assembly are held in electrical contact with the contacts of the substrate by the resilience of the deflectable lip regions contacting the conductive joining units.

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First Claim