IC card having fingerprint sensor designed to withstand bending
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United States of America Patent
Stats
-
Dec 17, 2002
Grant Date -
Jul 12, 2001
app pub date -
Jan 11, 2001
filing date -
Jan 11, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A chip card comprising a card made from a plastics material (1) capable of elastically withstanding a relative bending and in which a microelectronic data processing chip (4) is encased, a thin microelectronic wafer (5) made from a semiconductor material, such as a finger print sensor, additionally being joined to the card (1). Said wafer (5) is sub-divided into a small number of juxtaposed chips (7) disposed in a given pattern and separated from one another by a predetermined distance (d) which is sufficient for each separating strip (8) of plastics material to be slightly bent without causing adjacent chips (7) to become unstuck and/or rupture; electrical links are established between the chips to provide electrical continuity.
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