Magnetron sputtering apparatus with an integral cooling and pressure relieving cathode
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 17, 2002
Grant Date -
N/A
app pub date -
Nov 9, 2000
filing date -
Nov 9, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A sputtering apparatus includes a sputtering process chamber, a sputtering target assembly, and an adjustable magnetron assembly. The sputtering target assembly includes heating/cooling passages within the sputtering target assembly. A first side of a heat exchanger/pressure relieving plate is attached to a target backing. A second or opposing side of the heat exchanger/pressure relieving plate is attached to an insulation cover to form, within the sputtering target assembly, pressure relieving vacuum passages. The target assembly completely covers and seals against a high-vacuum-compatible insulator resting over and sealed to a top flange of the process chamber. A magnetron assembly resting over the target assembly, is independent from vacuum, or vacuum components, and provides means to move or scan a magnetron or magnet array over the target assembly. The distance between the magnetron and target assembly is adjustable throughout the useful life of the target independent from vacuum, or vacuum components.
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