Wet processing methods for the manufacture of electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 17, 2002
Grant Date -
N/A
app pub date -
Dec 10, 1998
filing date -
Dec 10, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention is directed to wet processing methods for the manufacture of electronic component precursors, such as semiconductor wafers used in integrated circuits. The electronic component precursors are placed in a reaction chamber and contacted with at least one reactive chemical process fluid for a selected period of time. The reactive process fluid can be, for example, hydrofluoric acid. The electronic component precursors are then exposed directly to a drying fluid, with no intervening rinsing fluid, for a selected period of time. The drying fluid can be a vapor.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully