Multilayer capacitance structure and circuit board containing the same and method of forming the same
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United States of America Patent
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-
Dec 17, 2002
Grant Date -
Jun 27, 2002
app pub date -
Dec 21, 2001
filing date -
Jun 12, 1996
priority date (Note) -
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Abstract
A method of forming a capacitive core structure and of forming a circuitized printed wiring board from the core structure and the resulting structures are provided. The capacitive core structure is formed by providing a central conducting plane of a sheet of conductive material and forming at least one clearance hole in the central conducting plane. First and second external conducting planes are laminated to opposite sides of the ground plane with a film of dielectric material between each of the first and second external planes and the central conducting plane. At least one clearance hole is formed in each of the first and second external planes. A circuitized wiring board structure can be formed by laminating a capacitive core structure between two circuitized structures. The invention also relates to the structures formed by these methods.
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