Compressible thermally-conductive interface
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United States of America Patent
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Dec 17, 2002
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N/A
app pub date -
Oct 12, 2000
filing date -
Nov 4, 1999
priority date (Note) -
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Abstract
A compressible and melt-flowable thermally conductive interface may be either tacky and pressure sensitive or be non-tacky and dry, and may include one of more thermally conductive fillers in one or more forms. The interface either melt flows or cures at low temperature, such as about 40-50.degree. C. Certain embodiments provide a bond strength between a heat generating component, such as an integrated circuit, power transistor and the like, and a heat dissipating element, such as a heat sink or cold plate, sufficient to permit elimination of the need for mechanical fasteners.
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