HEADSET WITH OVERMOLD
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United States of America Patent
Stats
-
Dec 17, 2002
Grant Date -
Dec 26, 2002
app pub date -
Jun 20, 2001
filing date -
Jun 20, 2001
priority date (Note) -
Granted
status (Latency Note)
Importance
Abstract
A headset is disclosed having a headband configuration that distributes the compression forces on the user's head to provide firm placement without causing discomfort to the user. The headband is preferably integrally formed with a soft overmold molded along a portion of its interface with the user's head. The headband terminates in first and second ends. Either or both ends may terminate in a flared temple pad for further distribution of compression forces or may terminate in an earphone. A boom is pivotally connected to either a temple pad or an earphone and is optionally conformable for positioning towards the wearer's mouth. The boom terminates in a microphone.
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Family
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Cited Art Landscape
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