Methods and apparatus for bonding deformable materials having low deformation temperatures
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United States of America Patent
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Dec 24, 2002
Grant Date -
N/A
app pub date -
Nov 6, 1997
filing date -
Nov 6, 1997
priority date (Note) -
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Abstract
Systems, methods and apparatus are disclosed for bonding a plurality of substrates via a solventless, curable adhesive. At least one of the substrates has a deformation temperature below the activation temperature of the adhesive. A workpiece is assembled from a plurality of substrates with the curable adhesive disposed therebetween. Pressure is applied to the workpiece and the workpiece is irradiated with variable frequency microwave energy. The workpiece is swept with at least one window of microwave frequencies selected to heat the adhesive without heating the substrates above their respective deformation temperatures.
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