Unbalanced plasma generating apparatus having cylindrical symmetry

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United States of America Patent

PATENT NO 6497803
APP PUB NO 20010050225A1
SERIAL NO

09805331

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Abstract

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Apparatus for creating subatmospheric high plasma densities in the vicinity of a substrate in a work space for use in magnetron sputter deposition aided by ion bombardment of the substrate. Unbalanced flux lines emanating from cylindrical or frusto-conical targets cannot be captured across the work space, because the energizing magnets are cylindrical, and instead converge toward the axis of the apparatus to provide a high flux density, and therefore a high plasma density, in the vicinity of a substrate disposed in this region. The plasma profile and the coating material profile within the work space are both cylindrically symmetrical, resulting in a consistent and predictable coating on substrates.

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Patent Owner(s)

Patent OwnerAddress
DENTON VACUUM L L C1259 NORTH CHURCH STREET MOORESTOWN NJ 08057

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Glocker, David A Rush, NY 35 495
Romach, Mark M Spencerport, NY 14 491

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