Thin film capacitance device and printed circuit board
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United States of America Patent
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Dec 24, 2002
Grant Date -
N/A
app pub date -
Oct 4, 2000
filing date -
Oct 5, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates to a thin film capacitor device having a copper wiring layer, a dielectric layer, and a barrier layer interposed between the wiring layer and the dielectric layer. The barrier layer has the function of preventing diffusion of copper of the wiring layer. The thin film capacitor device may also include an insulating substrate, a planarizing layer, an adhesion layer, and an intermediate layer. The present invention may also relate to a printed circuit substrate having the described thin film capacitor device built therein as a capacitor.
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