Low signal loss bonding ply for multilayer circuit boards
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United States of America Patent
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Dec 31, 2002
Grant Date -
N/A
app pub date -
Sep 14, 2001
filing date -
Sep 14, 2001
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
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