Fluorescence-enhanced chip

United States of America Patent

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Dec 31, 2002
Grant Date
Sep 19, 2002
app pub date
Mar 4, 2002
filing date
Mar 15, 2001

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Expired

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Abstract

The present invention aims to achieve a chip having a construction in which each film of metal, dielectric, and fluorescent material is stacked on a glass substrate 1. Such a construction can enhance the intensity of fluorescence emitted from a fluorescent material owing to the interaction between the fluorescent material and the light propagation mode in that construction.

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Patent Owner(s)

Patent Owner	Address
YOKOGAWA ELECTRIC CORPORATION A CORP OF JAPAN	9-32 NAKACHO 2-CHOME MUSASHINO-SHI TOKYO
CENTER FOR ADVANCED SCIENCE AND TECHNOLOGY INCUBATION LTD A CORP OF JAPAN	6TH FLOOR SHIN-MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Akimoto, Takuo	Musashino, JP	19	88
Ikebukuro, Kazunori	Koganei, JP	14	93
Karube, Isao	Tokyo, JP	68	1574
Tanaami, Takeo	Musashino, JP	113	1298
Yano, Kazuyoshi	Tokyo, JP	17	77

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Fluorescence-enhanced chip

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10090518

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PATENT NO	6500679
APP PUB NO	20020132376A1
SERIAL NO	10090518
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
December 31, 2002	US,6500679,B2 US6500679B2	GRANTED PATENT AS SECOND PUBLICATION
September 19, 2002	US,20020132376,A1 US20020132376A1	FIRST PUBLISHED PATENT APPLICATION

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